XC7VX485T-1FF1761I ApplicationField
-5G Technology
-Wireless Technology
-Consumer Electronics
-Medical Equipment
-Cloud Computing
-Internet of Things
-Industrial Control
-Artificial Intelligence
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XC7VX485T-1FF1761I FAQ
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A: EBICS does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
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XC7VX485T-1FF1761I Features
Ruggedized packaging
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Designed for high performance and lowest power with 28 nm, HKMG, and HPL process.
Long-term availability
Wire-bond and high signal integrity lidded flip-chip ruggedized packages offering easy migration between family members in the same package. All packages are available in Pb option.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high performance filtering, including optimized symmetric coefficient filtering.
Fully leaded (Pb) content
Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
Mask set control
Full-range extended temperature testing
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XC7VX485T-1FF1761I Overview
Xilinx XC7VX485T-1FF1761I FPGAs address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the high reliability requirements beyond commercial applications.Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7VX485T-1FF1761I FPGAs enable an unparalleled increase in system performance with 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
XC7VX485T-1FF1761I Tags
XC7VX485T development board
Virtex-7 FPGAs evaluation kit
XC7VX485T-1FF1761I Datasheet PDF
Xilinx Virtex-7 FPGAs development board
Virtex-7 FPGAs XC7VX485T
XC7VX485T reference design
Virtex-7 FPGAs starter kit
Xilinx XC7VX485T
XC7VX485T-1FF1761I TechnicalAttributes
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Package / Case 1760-BBGA, FCBGA
-Number of I/O 700
-Mounting Type Surface Mount
-Voltage – Supply 0.97V ~ 1.03V
-Supplier Device Package 1761-FCBGA (42.5×42.5)
-Number of LABs/CLBs 37950
-Total RAM Bits 37969920
-Number of Logic Elements/Cells 485760
-Total RAM Bits 37969920
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