XA3S1000-4FGG456I ApplicationField
-Artificial Intelligence
-Internet of Things
-Consumer Electronics
-Industrial Control
-Wireless Technology
-Cloud Computing
-5G Technology
-Medical Equipment
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XA3S1000-4FGG456I FAQ
Q: Where can I purchase Xilinx XA3S1000 Development Boards, Evaluation Boards, or XA Spartan-3 Automotive FPGA Starter Kit? also provide technical information?
A: EBICS does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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XA3S1000-4FGG456I Features
• Logic resources
♦ Wide multiplexers
♦ Signal swing ranging from 1.14V to 3.45V
• AEC-Q100 device qualification and full PPAP documentation support available in both extended temperature Q-grade and I-grade
• SelectIO interface signaling
• Low cost, high-performance logic solution for high-volume, automotive applications
♦ Eighteen single-ended signal standards
♦ Up to 487 I/O pins
♦ Termination by Digitally Controlled Impedance
• Revolutionary 90-nanometer process technology
♦ Abundant logic cells with shift register capability
♦ 622 Mb/s data transfer rate per I/O
♦ Three power rails: for core (1.2V), I/Os (1.2V to 3.3V), and auxiliary purposes (2.5V)
♦ Eight differential signal standards including LVDS
• Guaranteed to meet full electrical specification over the TJ = –40°C to +125°C temperature range
♦ Double Data Rate (DDR) support
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XA3S1000-4FGG456I Overview
The Xilinx XA3S1000-4FGG456I of Field-Programmable Gate Arrays meets the needs of high-volume, cost-sensitive automotive electronic applications. The five-member family offers densities ranging from 50,000 to 1.5 million system gates.XA devices are available in both extended-temperature Q-grade (–40°C to +125°C TJ) and I-grade (–40°C to +100°C TJ) and are qualified to the industry-recognized AEC-Q100 standard. The XA3S1000-4FGG456I builds on the success of the earlier XA Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. These Spartan-3 enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XA3S1000-4FGG456I FPGAs are ideally suited to a wide range of advanced automotive electronics modules and systems ranging from the latest driver assistance and infotainment systems to instrument clusters and gateways. The XA3S1000-4FGG456I is a flexible alternative to ASICs, ASSPs, and microcontrollers. FPGAs avoid the high initial NREs, the lengthy development cycles, and problems with obsolescence. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary.
The Xilinx Microcontrôlleur 8 Bit series XA3S1000-4FGG456I is XA3S1000-4FG456I, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at EBICS.com,
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XA3S1000-4FGG456I Tags
XA Spartan-3 Automotive FPGA XA3S1000
Xilinx XA Spartan-3 Automotive FPGA development board
XA3S1000 evaluation board
XA Spartan-3 Automotive FPGA starter kit
XA3S1000 reference design
XA Spartan-3 Automotive FPGA evaluation kit
XA3S1000-4FGG456I Datasheet PDF
XA3S1000 development board
XA3S1000-4FGG456I TechnicalAttributes
-Voltage – Supply 1.14V ~ 1.26V
-Number of Gates 1000000
-Supplier Device Package 456-FBGA (23×23)
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of Logic Elements/Cells 17280
-Package / Case 456-BBGA
-Number of I/O 333
-Total RAM Bits 442368
-Mounting Type Surface Mount
-Number of LABs/CLBs 1920
-Total RAM Bits 442368
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