Small-Outline J-Leaded Package or SOJ is a type of Integrated Circuit (IC) packaging design shaped in the form of the letter, “J”. This article discusses in-depth, the root of the package, its thermal properties, advantages and factors to consider when working with it.
Optimization of the SOJ IC Package
Small-Outline J-Leaded Package (SOJ) is a variant of the Small Outline Integrated Circuit (SOIC) package. It is designed in a way that its leads or pins take on the J-type of design. Also, the package uses these types of leads because of the significant improvements it offers over the gull-wing leads.
Pin Design
The pins or leads of the SOJ are outstanding, in the sense that they protrude out of the longer edges of the package. The J-shaped pins or leads are positioned on the long sides of the package and to a considerable extent, make circuit board configurations simpler.
Properties of the SOJ
Here are some of the characteristics of technical properties making up the Small Outline J-Leaded Package (SOJ):
1. Varieties of Pins/Leads
The package offers a variety of pins or leads. The minimum number of leads on the package is 16 and can be as high as 40.
Worthy of mentioning is that the different pins or leads have different body heights and lead pitches.
For example, the 16-pin SOJ has a body height of 2.9 mm and a lead pitch of 1.27mm. Its body size is estimated at 7.5 mm by 12.8 mm.
The 40-pin SOJ has a body size of 10.2 mm by 26 mm; a lead pitch of 1.27 mm and a body height of 3.5 mm.
2. Underlying Technology
The SOJ uses the Surface Mount Technology (SMT); the underlying technology that powers the Small Outline Package (SOP), of which the SOJ is one of that.
The idea is to use the SMT to simplify the placement of the Printed Circuit Boards (PCBs) on the surface.
3. SOJ is Industry-Compliant
Just like the other Small Outline IC Packages, the SOJ is compliant with industry standards. It follows the blueprints of configuring circuits boards in line with JEDEC; one of the IC package industry standards.
4. SOJ is Available in Several Widths
In compliance with the JEDEC standards, the SOJ is readily available in several widths. Examples of the supported body widths are:
- 7.5mm (300mil)
- 1.27mm (50mil)
- 10.2mm (400mil)
The Importance of the SOJ IC Packaging
These are some of the reasons why we think you should consider working with the SOJ Integrated Circuit (IC) package.
1. It Enhances Device Functionality
Modern Integrated Circuits (ICs) hardly rely on the larger-sized circuit boards. The emphasis is now on the boards that can utilize the smallest spaces and deliver value on a budget. That aptly describes the SOJ, one of the Small Outline Packages (SOPs) optimized for space and cost-savings.
Through the reduced space, the packaging is also able to switch up the silicon yield resilience, enhance the device’s functionality and reduce the general size of the Integrated Circuit (IC).
2. Improved Industry Standards for Devices
Packaging the devices with an IC package is one of the last steps before these devices are sent out for testing.
Therefore, using the SOJ for the circuit boards can go a long way to increase the chances of these devices to meet the minimum industry standards.
From the priorities placed on the JEDEC and JEITA (EIAJ) industry standards to the improved architecture of the devices, it is clear that using the SOJ can help improve the testing outcome of these devices.
3. SOJ Improves the Thermal Conductivity of Devices
Thermal conductivity has to do with the ability of the targeted applications or devices to manage the heat coming from the board.
Some of the Small Outline J-Leaded Packages (SOJ) are manufactured with either plastic or ceramic materials. Those go a long way to bolster the heat dissipation of the circuit boards, while keeping the board fully functional.
4. Lower Pin Counts
On an estimate, the traditional Small Outline Package (SOP) uses a pin count between 8 and 44. On the other hand, the number of pins or leads on the Small Outline J-Leaded Package (SOJ) appears to be lower.
For example, the pin count ranges from 16 and 40. While that may seem to be limiting, it doesn’t appear to be entirely so.
Taking a cue from the industry standard of JEDEC, it isn’t entirely easy to predict the possible performance of having more pins/leads on the package than having fewer. Therefore, the saying that “less is more” suffices here.
Buying Guide for the SOJ
What and what do you consider if you are to buy the Small Outline J-Leaded Package (SOJ) for your next IC design? We have the following recommendations to make:
Consider the Body Height
The height of the SOJ has to do with the space between the top and bottom of the package. As a small form-factor IC package, you want the height to be accommodating, and not to prevent the integration of other components.
Luckily, you have varieties of body heights (including the leads) to choose from. Examples are choosing from the minimum of 2.9 mm body height to the maximum body height of 3.5 mm.
Consider the Applications or Targeted Devices
The major devices or applications designed with the Small Outline J-Leaded Package (SOJ) are the memory devices. These are the devices that use a narrow edge for lining up the pins or leads. The SOJ may also be suitable for other memory-specific devices.
Cost of the Package
SOJ is considerably lower because it uses lesser space and requires only a few components. The use of the Surface Mount Technology (SMT) also helps to cut down the costs.
Therefore, you can be assured that using this IC package can considerably reduce the cost of manufacturing the targeted devices.
Final Thoughts
Small Outline J-Leaded Package (SOJ) helps to save space, accommodate as much components as possible and reduce the costs of manufacturing an Integrated Circuit (IC).
Contact RayPCB, a professional SOJ designer to help you with the configurations.
