To ensure that your semiconductor works properly and reliably over long periods (years) it is necessary to protect every chip from possible stresses and elements. From here, there are two main questions. What does packaged ic mean? And why is packaged IC important for electronics applications?
As we go through this article, we will explain what packaged IC is, and why it is important.
What is a Packaged IC?
IC packaging or packaged IC is the final stage when producing semiconductor device. At this stage, there is a covering of the semiconductor block in the package. This helps in protecting the integrated circuit from damaging the external elements, as well as the corrosive effect that age brings. This package is importantly an encasement that is designing to help in protecting the block. It also promotes all the electrical contacts that help in delivering signals to the device’s circuit board.
What are the Common Packaged IC Types?
There are different ways to group packaged IC designs with respect to the formation. Due to this reason, IC package exists in two main types: the substrate type and the lead-frame type.
Types of Packaged IC
Beyond the packaged IC’s structural definition, some other categories help in distinguishing categories of packaged IC.
Dual-inline and lead-frame packages: These are packages for assemblies whereby the pins pass through holes
Pin-grid array: This is for packaging
Quad flat pack: This is the lead-frame package of leadless variety
Chip scale package: This is a direct surface single die package, having an area less than 1.2x the die’s area.
Area array package: This package offers the best possible performance coupled with conserving and saving space by letting a portion of the surface area of the chip to be used in interconnection.
Multichip package: This is also known as multichip modules. This helps in integrating multiple integrated circuits, semiconductor dies, and discrete components onto a specific substrate. This makes the multichip package to look like the larger IC.
Quad flat no-lead: This is a very tiny package, like a chip’s size, that is useful in surface mounting
Importantly, you should note that a very good number of companies make use of area array packages. Regarding this, the first example is BGA package. This comes in different formats, which includes tiny or small chip scale packages, which s at times called QFN packages, as well as larger packages.
The BGA construction has to do with the organic substrate. Its most appropriate application is found in multichip structures. The multichip packages and structures are the top options and alternatives to solutions using the system-on-chip format. There are other options, which includes double-surface and two-stepped interconnection packages.
In addition, the water IC assembly category, which is called WLP (wafer-level packaging), has come to light. In the wafer level packages, this construction appears on the face of the wafer. This creates a package that forms the flip chip’s size.
Which Packaged IC is Most Common?
Of all the well-known types of packaged IC, lead frames are the most common. These packages are useful in interconnected wire-bond dies, having a gold or silver-plated finish. For the surface mount plastic packages, the manufacturers usually make use of the lead-frame copper materials. The copper here is known to be very compliant and conductive. This is why it is very useful for this purpose
What are the Design Considerations for Packages IC?
Working with the best IC package for different applications begins with some important factors. These include having some technical information regarding different design considerations which goes into the production of the packaged IC.
Take for instance, you will need to know the right substrates and compositions for the material that will suit your packaged IC. Also, it is very necessary to know the main difference between the tape and rigid package substrates. Furthermore, many companies usually think of making use of laminates as other options in selecting substrates and lead frames. This functions properly with the metal conductors.
Material Composition
Here the packaged IC performance largely relies on the material, electrical, and chemical makeup. With respect to the functional differences, the laminate and lead-frame packages rely heavily on the material composition. In addition, the prevailing format, lead-frame packages, makes use of the golf or silver wire-bond finishes. This is attached with the spot-plating method. With this, the process becomes more affordable and simpler.
On the ceramic packages, the Alloy 42 is a well-known used type of metal due to the fact that it works with an underlying material. Furthermore, on the plastic package, it is preferable to work with the copper lead, this is because it protects the solder joints as well as offer conductivity. As a result of the policies present in some territories, this material is part of the important factors present on the surface mount type plastic packages
Alternative to the Lead Frames
Beginning from the late 1970s, the laminates came out as an option to the lead frames in the chip-to-board assemblies. As of today, the laminates have become widespread all through the packaged IC solutions industry. This is as a result of their cost-effectiveness in contrast to the ceramic substrates. Of all these laminates, the most famous of all are the high-temperature, organic types that offer better electrical features and are more affordable as well.
Applicable Substrates
Despite the rise in the populous nature of the semiconductor packages, there has also been a rise in demand for the applicable interposers and substrates. The substrate forms a part of the IC package, which offers mechanical strength to the board. It also allows the connection to the external devices. Furthermore, the interposer allows the connective routing in that package. There are cases whereby the two words “interposer” and “substrate” are interchangeable.
Conclusion
From this article, it is clear that there are lots of elements to packaged IC for the different electronic systems. Also, as a player serving the electronics industry, it is very necessary to have a good understanding of them. Furthermore, stay set for the necessary developments regarding advanced packaged IC.
