Congait Expands COM-HPC and COM Express Computer Modules Based on 12th Generation Intel Core Processors with Seven New, More Power Efficient Processors
Shanghai, China, 28 June 2022 – Congatec, a leading provider of embedded and edge computing technologies, introduces seven lower power COM- and COM Express modules based on the 12th generation Intel Core IOTG mobile processors (codenamed Alder Lake). HPC and COM Express modules. Using the latest Intel hybrid architecture with performance cores (P-core) and energy efficiency cores (E-core); their BGA package processor base power consumption is only 15-28W, which allows engineers to use them for embedded and edge computing platforms with fully passive cooling. This not only reduces the cost of costly thermal solutions, but also increases the durability and reliability of system designs.
Lower power consumption is achieved primarily by reducing the number of P-core and maintaining the number of E-core. For example, in the performance range of Intel Core i7 processors, different loads can benefit from eight E cores for each version of the processor, which can reduce six P cores (12800HE/45 W base power) to four (1270PE/28 W base power) or two (1265UE/15 W base power). Another energy saving is the reduction of PCIe lanes (28 → 20). These selected processors are suitable for hard real-time applications, support for virtual machines and Intel TCC and TSN technologies, making the new Conjoint Computer Module very suitable for integrating many different workloads, such as AI and/or immersive GUI in a single passively cooled edge computing platform
With Intel Core i7/5/3 and Celeron processors, the new high-performance computer modules are targeted for a variety of computing systems that use passive cooling but require higher performance, such as edge computers and IoT gateways (containing multiple virtual machines for smart factories and process automation), AI quality inspection and industrial vision, real-time collaborative robotics, and automated logistics vehicles for warehousing and transportation. Common outdoor uses include self-driving vehicles and mobile machinery, video surveillance and access control in transportation and smart cities, and 5G microclouds and edge devices that require AI packet inspection capabilities.
These new Kangate computer modules feature multiple core combinations, support DDR5 memory with PCIe Gen 4 lanes, and support Intel Hybrid Architecture to accelerate multi-threaded applications and make background task processing more efficient. In addition, with excellent graphics performance, it supports Intel Torch Xe GPU with up to 96 execution units.
In addition to the large bandwidth and comprehensive performance improvements, the new flagship COMHPC Client and COM Express Type 6 module’s dedicated AI engine supports Windows ML, Intel OpenVINO tool suite and Chrome Cross ML. Different AI work tasks can be seamlessly assigned to P-core, E-core and GPU execution units to meet the requirements of computationally intensive edge AI tasks. In addition, Intel’s low-power built-in AI gas pedal, Intel Gaussian & Neural Accelerator 3.0 (Intel GNA 3.0) features dynamic noise removal and speech recognition, and can even run in low power states and respond to voice wake commands.
In addition to these features, they also support Real-TIme Systems’ Virtual Machine Monitor (Hypervisor) technology, as well as real-time Linux and Wind River VxWorks operating systems. This makes these modules a truly all-encompassing ecosystem solution that can facilitate and accelerate the development of edge computing applications.
Feature Details
The new conga-HPC/cALP COM-HPC Client Size A module (95x120mm) and the conga-TC670 COM Express Compact Type 6 module (95x95mm) offer six models based on energy-efficient 12th generation Intel Core processors and one cost effective Celeron processor. Both series of modules support up to 64GB of ultra-fast DDR5 SO-DIMM memory at up to 4,800 MT/s. The Intel Core i7 and i5 processors include Intel Torch Xe integrated graphics, while the i3 and Celeron processors include UHD graphics, providing excellent graphics performance supporting up to four independent displays with up to 8K resolution. To enable the connection of high bandwidth peripherals, the COM-HPC module supports up to 16 PCIe Gen 4 and 8 PCIe Gen 3 lanes with up to 2 Thunderbolt interfaces, while the COM Express module features up to 8 PCIe Gen 4 and 8 PCIe Gen 3 lanes. Both types are available with optional ultra-fast NVMe SSDs and additional storage devices can be connected via 2 SATAGen3 interfaces. For networking, the COM-HPC module has 2 x 2.5GbE while the COM Express module has 1 x 2.5GbE and both support TSN. for sound, the COM-HPC module offers SoundWire, HDA, I2S while the COM Express module offers HDA interface. Each module’s carrier board support suite supports all major real-time operating systems, including Real-TIme Systems’ Hypervisor, as well as Linux,, Windows and Android.
The conga-TC670 COM Express Type 6 Compact (95x95mm) and conga-HPC/cALP COMHPC Client Size A (95x120mm) module series based on 12th generation Intel Core processors include the following 10 configurations.
