XC7K70T-2FBG484C ApplicationField
-Wireless Technology
-Artificial Intelligence
-Cloud Computing
-Consumer Electronics
-Medical Equipment
-Internet of Things
-Industrial Control
-5G Technology
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XC7K70T-2FBG484C FAQ
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XC7K70T-2FBG484C Features
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
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XC7K70T-2FBG484C Overview
Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:Artix®-7 Family: Optimized for lowest cost and power with small form-factor packaging for the highest volume applications.Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
The Xilinx FPGAs (Field Programmable Gate Array) series XC7K70T-2FBG484C is FPGA, Kintex-7, MMCM, PLL, 185 I/O’s, 710 MHz, 65600 Cells, 970 mV to 1.03 V, FCBGA-484, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at EBICS.com,
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XC7K70T-2FBG484C Tags
XC7K70T development board
Xilinx XC7K70T
Xilinx Kintex-7 FPGAs development board
XC7K70T evaluation board
Kintex-7 FPGAs evaluation kit
XC7K70T reference design
Kintex-7 FPGAs XC7K70T
Kintex-7 FPGAs starter kit
XC7K70T-2FBG484C TechnicalAttributes
-Package / Case 484-BBGA, FCBGA
-Mounting Type Surface Mount
-Total RAM Bits 4976640
-Number of I/O 285
-Voltage – Supply 0.97V ~ 1.03V
-Supplier Device Package 484-FCBGA (23×23)
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Number of LABs/CLBs 5125
-Number of Logic Elements/Cells 65600
-Number of LABs/CLBs 5125
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