EP2C70F672C6N ApplicationField
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EP2C70F672C6N FAQ
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EP2C70F672C6N Features
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EP2C70F672C6N Overview
Features
The Cyclone II device family offers the following features:
■ High-density architecture with 4,608 to 68,416 LEs
● M4K embedded memory blocks
● Up to 1.1 Mbits of RAM available without reducing available logic
● 4,096 memory bits per block (4,608 bits per block including 512 parity bits)
● Variable port configurations of ×1, ×2, ×4, ×8, ×9, ×16, ×18, ×32, and ×36
● True dual-port (one read and one write, two reads, or two writes) operation for ×1, ×2, ×4, ×8, ×9, ×16, and ×18 modes
● Byte enables for data input masking during writes
● Up to 260-MHz operation
■ Embedded multipliers
● Up to 150 18- × 18-bit multipliers are each configurable as two independent 9- × 9-bit multipliers with up to 250-MHz performance
● Optional input and output registers
■ Advanced I/O support
● High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL, differential HSTL, and differential SSTL
● Single-ended I/O standard support, including 2.5-V and 1.8-V, SSTL class I and II, 1.8-V and 1.5-V HSTL class I and II, 3.3-V PCI and PCI-X 1.0, 3.3-, 2.5-, 1.8-, and 1.5-V LVCMOS, and 3.3-, 2.5-, and 1.8-V LVTTL
● Peripheral Component Interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 3.0 compliance for 3.3-V operation at 33 or 66 MHz for 32- or 64-bit interfaces
● PCI Express with an external TI PHY and an Altera PCI Express ×1 Megacore® function
● 133-MHz PCI-X 1.0 specification compatibility
● High-speed external memory support, including DDR, DDR2, and SDR SDRAM, and QDRII SRAM supported by drop in Altera IP MegaCore functions for ease of use
● Three dedicated registers per I/O element (IOE): one input register, one output register, and one output-enable register
● Programmable bus-hold feature
● Programmable output drive strength feature
● Programmable delays from the pin to the IOE or logic array
● I/O bank grouping for unique VCCIO and/or VREF bank settings
● MultiVolt™ I/O standard support for 1.5-, 1.8-, 2.5-, and 3.3-interfaces
● Hot-socketing operation support
● Tri-state with weak pull-up on I/O pins before and during configuration
● Programmable open-drain outputs
● Series on-chip termination support
■ Flexible clock management circuitry
● Hierarchical clock network for up to 402.5-MHz performance
● Up to four PLLs per device provide clock multiplication and division, phase shifting, programmable duty cycle, and external clock outputs, allowing system-level clock management and skew control
● Up to 16 global clock lines in the global clock network that drive throughout the entire device
■ Device configuration
● Fast serial configuration allows configuration times less than 100 ms
● Decompression feature allows for smaller programming file storage and faster configuration times
● Supports multiple configuration modes: active serial, passive serial, and JTAG-based configuration
● Supports configuration through low-cost serial configuration devices
● Device configuration supports multiple voltages (either 3.3, 2.5, or 1.8 V)
■ Intellectual property
● Altera megafunction and Altera MegaCore function support, and Altera Megafunctions Partners Program (AMPPSM) megafunction support, for a wide range of embedded processors, on-chip and off-chip interfaces, peripheral functions, DSP functions, and communications functions and protocols. Visit the Altera IPMegaStore at www.altera.com to download IP MegaCore functions.
● Nios II Embedded Processor support
Functional Description
Cyclone® II devices contain a two-dimensional row- and column-based architecture to implement custom logic. Column and row interconnects of varying speeds provide signal interconnects between logic array blocks (LABs), embedded memory blocks, and embedded multipliers.
The logic array consists of LABs, with 16 logic elements (LEs) in each LAB. An LE is a small unit of logic providing efficient implementation of user logic functions. LABs are grouped into rows and columns across the device. Cyclone II devices range in density from 4,608 to 68,416 LEs.
Cyclone II devices provide a global clock network and up to four phase-locked loops (PLLs). The global clock network consists of up to 16 global clock lines that drive throughout the entire device. The global clock network can provide clocks for all resources within the device, such as input/output elements (IOEs), LEs, embedded multipliers, and embedded memory blocks. The global clock lines can also be used for other high fan-out signals. Cyclone II PLLs provide general-purpose clocking with clock synthesis and phase shifting as well as external outputs for high-speed differential I/O support.
M4K memory blocks are true dual-port memory blocks with 4K bits of memory plus parity (4,608 bits). These blocks provide dedicated true dual-port, simple dual-port, or single-port memory up to 36-bits wide at up to 260 MHz. These blocks are arranged in columns across the device in between certain LABs. Cyclone II devices offer between 119 to 1,152 Kbits of embedded memory
Each embedded multiplier block can implement up to either two 9 × 9-bit multipliers, or one 18 × 18-bit multiplier with up to 250-MHz performance. Embedded multipliers are arranged in columns across the device
Each Cyclone II device I/O pin is fed by an IOE located at the ends of LAB rows and columns around the periphery of the device. I/O pins support various single-ended and differential I/O standards, such as the 66- and 33-MHz, 64- and 32-bit PCI standard, PCI-X, and the LVDS I/O standard at a maximum data rate of 805 megabits per second (Mbps) for inputs and 640 Mbps for outputs. Each IOE contains a bidirectional I/O buffer and three registers for registering input, output, and output-enable signals. Dual-purpose DQS, DQ, and DM pins along with delay chains (used to phase-align double data rate (DDR) signals) provide interface support for external memory devices such as DDR, DDR2, and single data rate (SDR) SDRAM, and QDRII SRAM devices at up to 167 MHz.
The INTEL Embedded – FPGAs (Field Programmable Gate Array) series EP2C70F672C6N is FPGA Cyclone II Family 68416 Cells 500MHz 90nm Technology 1.2V 672Pin FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at EBICS.com,
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EP2C70F672C6N Tags
INTEL EP2C70
Cyclone II FPGA EP2C70
EP2C70 reference design
EP2C70 evaluation board
EP2C70F672C6N Datasheet PDF
Cyclone II FPGA evaluation kit
INTEL Cyclone II FPGA development board
Cyclone II FPGA starter kit
EP2C70F672C6N TechnicalAttributes
-Number of I/Os 422
-Packaging Tray
-Operating Supply Voltage 1.15 V to 1.25 V
-Maximum Operating Temperature + 70 C
-Embedded Block RAM – EBR 1152 kbit
-Package / Case FBGA-672
-Minimum Operating Temperature 0 C
-Mounting Style SMD/SMT
-Series Cyclone II
-Number of Logic Blocks 4276
-Mounting Style SMD/SMT
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