XC7S75-2FGGA676C ApplicationField
-Wireless Technology
-Consumer Electronics
-Industrial Control
-Internet of Things
-Medical Equipment
-5G Technology
-Cloud Computing
-Artificial Intelligence
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XC7S75-2FGGA676C FAQ
Q: Where can I purchase Xilinx XC7S75 Development Boards, Evaluation Boards, or FPGA Spartan-7 Starter Kit? also provide technical information?
A: EBICS does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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Q: How to obtain XC7S75-2FGGA676C technical support documents?
A: Enter the “XC7S75-2FGGA676C” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
Q: Does the price of XC7S75-2FGGA676C devices fluctuate frequently?
A: The EBICS search engine monitors the XC7S75-2FGGA676C inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.
XC7S75-2FGGA676C Features
• Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
• Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
• Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
• Quickly deploy embedded processing with MicroBlaze processor.
• Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
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XC7S75-2FGGA676C Overview
Xilinx 7 XC7S75-2FGGA676C FPGAs address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications.
XC7S75-2FGGA676C Tags
Xilinx FPGA Spartan-7 development board
XC7S75 evaluation board
FPGA Spartan-7 evaluation kit
XC7S75 reference design
Xilinx XC7S75
FPGA Spartan-7 XC7S75
FPGA Spartan-7 starter kit
XC7S75-2FGGA676C Datasheet PDF
XC7S75-2FGGA676C TechnicalAttributes
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Voltage – Supply 0.95V ~ 1.05V
-Total RAM Bits 4331520
-Number of Logic Elements/Cells 76800
-Mounting Type Surface Mount
-Supplier Device Package 676-FPBGA (27×27)
-Number of I/O 400
-Package / Case 676-BGA
-Number of LABs/CLBs 6000
-Package / Case 676-BGA
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