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XQR4036XL-2CB228M XQR4036XL development board Xilinx QPRO XQR4000XL Radiation Hardened FPGAs development board

XQR4036XL-2CB228M ApplicationField

-Industrial Control
-Internet of Things
-Wireless Technology
-5G Technology
-Cloud Computing
-Artificial Intelligence
-Medical Equipment
-Consumer Electronics

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XQR4036XL-2CB228M FAQ

Q: Where can I purchase Xilinx XQR4036XL Development Boards, Evaluation Boards, or QPRO XQR4000XL Radiation Hardened FPGAs Starter Kit? also provide technical information?
A: EBICS does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: How to obtain XQR4036XL-2CB228M technical support documents?
A: Enter the “XQR4036XL-2CB228M” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the XQR4036XL-2CB228M pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.

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XQR4036XL-2CB228M Features

Radiation-hardened FPGAs for space and satellite applications
Internal node observability
Systems-oriented features

IEEE 1149.1-compatible boundary scan logic support

Individually programmable output slew rate

Programmable input pull-up or pull-down resistors

12 mA sink current per output
Advanced 0.35µ process
Hierarchy of interconnect lines
Configured by loading binary file

Unlimited reprogrammability
Optional multiplexer or 2-input function generator on device outputs
Buffered interconnect for maximum speed
Programmable input pull-up or pull-down resistors
dual-port RAM option
Interfaces to popular design environments
Virtually unlimited number of clock signals
Flexible array architecture
Processed on Xilinx QML line
Unlimited reprogrammability
System featured FPGAs

SelectRAM memory: on-chip ultra-fast RAM with

synchronous write option

dual-port RAM option

Abundant flip-flops

Flexible function generators

Dedicated high-speed carry logic

Wide edge decoders on each edge

Hierarchy of interconnect lines

Internal 3-state bus capability

Eight global low-skew clock or signal distribution networks
Flexible function generators
SelectRAM memory: on-chip ultra-fast RAM with

synchronous write option

dual-port RAM option
Program verification
Eight global low-skew clock or signal distribution networks
12 mA sink current per output
Available in -3 speed
Latch-up immune
Guaranteed total ionizing dose
New latch capability in configurable logic blocks
Highest capacity: over 130,000 usable gates
Low power segmented routing architecture
Interactive design editor for design optimization
5V tolerant I/Os
System performance beyond 60 MHz
Fully automatic mapping, placement and routing
Improved VersaRing I/O interconnect for better fixed pinout flexibility

Virtually unlimited number of clock signals
Low soft upset rate
Development system runs on most common computer platforms

Interfaces to popular design environments

Fully automatic mapping, placement and routing

Interactive design editor for design optimization

 

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XQR4036XL-2CB228M Overview

 

Power-On Power Supply Requirements

Xilinx FPGAs require a minimum rated power supply current
capacity to insure proper initialization, and the power supply
ramp-up time does affect the current required. A fast
ramp-up time requires more current than a slow ramp-up
time. The slowest ramp-up time is 50 ms. Current capacity
is not specified for a ramp-up time faster than 2 ms. The current capacity varies linealy with ramp-up time, e.g., an
XQR4036XL-2CB228M with a ramp-up time of 25 ms would require a
capacity predicted by the point on the straight line drawn
from 1A at 120 µs to 500 mA at 50 ms at the 25 ms time
mark. This point is approximately 750 mA .

XQR4000XL AC Switching Characteristic

Testing of the switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values where one global clock input
drives one vertical clock line in each accessible column, and
where all accessible IOB and CLB flip-flops are clocked by
the global clock net.

When fewer vertical clock lines are connected, the clock distribution is faster; when multiple clock lines per column are driven from the same global clock, the delay is longer. For
more specific, more precise, and worst-case guaranteed
data, reflecting the actual routing structure, use the values
provided by the static timing analyzer (TRCE in the Xilinx
Development System) and back-annotated to the simulation
netlist. These path delays, provided as a guideline, have
been extracted from the static timing analyzer report. All
timing parameters assume worst-case operating conditions
(supply voltage and junction temperature)

XQR4000XL CLB Switching Characteristic Guidelines

Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist.
All timing parameters assume worst-case operating conditions (supply voltage and junction temperature). Values
apply to all XQR4000XL devices and expressed in nanoseconds unless otherwise noted.

XQR4036XL-2CB228M Tags

Xilinx XQR4036XL
QPRO XQR4000XL Radiation Hardened FPGAs XQR4036XL
QPRO XQR4000XL Radiation Hardened FPGAs starter kit
XQR4036XL-2CB228M Datasheet PDF
Xilinx QPRO XQR4000XL Radiation Hardened FPGAs development board
QPRO XQR4000XL Radiation Hardened FPGAs evaluation kit
XQR4036XL development board
XQR4036XL reference design

XQR4036XL-2CB228M TechnicalAttributes

 

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