XC3090-70PP175C ApplicationField
-Internet of Things
-Wireless Technology
-Consumer Electronics
-5G Technology
-Cloud Computing
-Medical Equipment
-Artificial Intelligence
-Industrial Control
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XC3090-70PP175C FAQ
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A: EBICS does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
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A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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XC3090-70PP175C Features
– Avoids the NRE, time delay, and risk of conventional masked gate arrays
– In-system logic changes
– Thin and Very Thin Quad Flat Pack (TQFP and VQFP) options
• High-performance CMOS static memory technology
– Replaces TTL, MSI, and other PLD logic
– On-chip crystal oscillator amplifier
• Ready for volume production
– Compatible arrays ranging from 1,000 to 7,500 gate complexity
– Guaranteed toggle rates of 70 to 325 MHz, logic delays from 9 to 2.2 ns
– High fan-out signal distribution, low-skew clock nets
– Internal 3-state bus capabilities
– Integrates complete sub-systems into a single package
– Standard, off-the-shelf product availability
• Unlimited reprogrammability
– Easy design iteration
– System clock speeds over 80 MHz
– 100% factory pre-tested devices
• Extensive Packaging Options
– Plastic and ceramic surface-mount and pin-grid· array packages
• Ideal for a wide range of custom VLSI design tasks
– Low quiescent and active power consumption
– TTL or CMOS input thresholds
– Extensive register, combinatorial, and 1/0 capabilities
– Over 20 different packages
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XC3090-70PP175C Overview
The CMOS XC3090-70PP175C of Logic Cell Array (LCA)
families provide a group of high-performance, high-density, digital integrated circuits. Their regular, extendable,
flexible, user-programmable array architecture is com·
posed of a configuration program store plus three types of
configurable elements: a perimeter of 1/0 Blocks (lOBs), a
core array of Configurable Logic Bocks (CLBs) and re·
sources for interconnection. The general structure of an
LCA XC3090-70PP175C device is shown in XC3090-70PP175C Diagram on the next page. The
XACT development system provides schematic capture
and auto place-and-route for design entry. Logic and
timing simulation, and in-circuit emulation are available as
design verification alternatives. The design editor is used
for interactive design optimization, and to compile the data
pattern that represents the configuration program.
The LCA user logic functions and interconnections are
determined by the configuration program data stored in
internal static memory cells. The program can be loaded in
any of several modes to accommodate various system
requirements. The program data resides externally in an
EEPROM, EPROM or ROM on the application circuit
board, or on a floppy disk or hard disk. On-chip initialization
logic provides for optional automatic loading of program
data at power-up. The companion XC17XX Serial
Configuration PROMs provide a very simple serial config·
uration program storage in a one-lime programmable
package.
XC3090-70PP175C Tags
XC3090-70PP175C Datasheet PDF
XC3090 reference design
Xilinx XC3000 Series FPGAs development board
XC3000 Series FPGAs XC3090
XC3000 Series FPGAs evaluation kit
XC3000 Series FPGAs starter kit
Xilinx XC3090
XC3090 development board
XC3090-70PP175C TechnicalAttributes
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