The biggest challenge for general purpose mcu chip manufacturers is to maintain differentiation, high quality, solution capability and well-matched development software. Differentiation means that the definition of mcu chips needs to converge with market demand. mcu product differentiation means that in the case of IoT fragmentation, using traditional soc designs that integrate rf circuits and mcu on the same wafer is a huge burden for mcu companies, including personnel, design environment, process manufacturing, ip licensing, R&D management, etc. These are not economical or realistic for mcu companies targeting fragmented markets. How to make MCU with the fastest and most economical way to load wireless function.
A quality-assured BLE RF chip communicating with a general-purpose MCU chip through a simple interface is an optimized solution for wireless MCUs. In this solution, the design, manufacturing and quality control of the RF chip follow the flow of an analog rf chip, while the generic mcu chip is done according to the flow of a conventional logic chip. Thus, the overall cost performance and Time-to-Market time will be greatly reduced.
And MCU chips allow the main design effort to be put into application-related development. This makes the whole design process and input simple and effective.
The two chips are combined by means of a PCB module or a joint package to complete the function. This work can be done by MCU or RF chip original manufacturer, or by solution provider. RF chip manufacturer Shanghai Jumbo supports the implementation of wireless functions by providing chip drivers and software protocol stacks.
In this way, by combining universal BLE RF chips and diverse microcontroller chips, manufacturers can quickly combine diverse and flexible BLE single-chip or modular solutions to meet different ecological needs and market demands.
How can add BLE functionality to existing MCUs quickly and provide BLE protocol stack integration and SIP solutions can enable MCU manufacturers to economically and quickly integrate BLE and better adapt to the IoT market.
There are very few companies that can provide the industry’s common BLE wireless front-end process chip. The hardware design of this chip is very simple, but its supporting protocol stack and software support requires long experience in Bluetooth and cell phone ecology, while the designer needs to have in-depth knowledge of various MCU ecologies. This solution is very large in terms of technology span. The MG126 provided by Shanghai Jumbo Micro is one of the best.
MG126 is oriented to mcu chip ecology, with appropriate mcu chip resources according to different applications and functional requirements, saving cost, providing cost-effective solutions and flexibly adapting to IoT fragmentation applications.
MG126 uses an original and innovative architecture design with common SPI communication interface, the chip itself does not need additional wake-up signals has saved MCU IO resources. The front-end chip contains RF and BLE digital baseband, which completes BLE broadcast and data reception/transmission, modulation/demodulation and baseband data conversion.
The BLE protocol stack runs on the MCU, multiplexing the MCU’s powerful processing and control capabilities and improving the resource utilization of the 32-bit MCU. The chip is available in a QFN16 package and is only 3mmX3mm in size.
