EP3C25F324C6N ApplicationField
-Internet of Things
-Cloud Computing
-Medical Equipment
-Wireless Technology
-5G Technology
-Consumer Electronics
-Artificial Intelligence
-Industrial Control
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EP3C25F324C6N FAQ
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Q: How to obtain EP3C25F324C6N technical support documents?
A: Enter the “EP3C25F324C6N” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
Q: Where can I purchase INTEL EP3C25 Development Boards, Evaluation Boards, or Cyclone III FPGAs Starter Kit? also provide technical information?
A: EBICS does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
Q: How can I obtain software development tools related to the INTEL FPGA platform?
A: Quartus Prime Modelsim is the corresponding programming software for FPGA produced by Altera/Intel. The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
Q: Does the price of EP3C25F324C6N devices fluctuate frequently?
A: The EBICS search engine monitors the EP3C25F324C6N inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.
EP3C25F324C6N Features
Cyclone III LS devices offer the following design security features:
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EP3C25F324C6N Overview
Cyclone III EP3C25F324C6N device offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants:■ Cyclone III—lowest power, high functionality with the lowest cost■ Cyclone III LS—lowest power FPGAs with securityWith densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power consumption, Cyclone III EP3C25F324C6N makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software, and intellectual property (IP) level on a low-power and high-functionality FPGA platform. This suite of security features protects the IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation which enables you to introduce redundancy in a single chip to reduce size, weight, and power of your application.Design Security Feature
The INTEL FPGA – Field Programmable Gate Array series EP3C25F324C6N is Cyclone™ III FPGAs: An Unprecedented Combination of Power, Functionality, and Cost; 324 pin FBGA; 0 to 85°C, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at EBICS.com,
and you can also search for other FPGAs products.
EP3C25F324C6N Tags
Cyclone III FPGAs evaluation kit
EP3C25F324C6N Datasheet PDF
EP3C25 evaluation board
Cyclone III FPGAs starter kit
Cyclone III FPGAs EP3C25
INTEL Cyclone III FPGAs development board
EP3C25 reference design
INTEL EP3C25
EP3C25F324C6N TechnicalAttributes
-Embedded Block RAM – EBR 608 kbit
-Mounting Style SMD/SMT
-Packaging Tray
-Operating Supply Voltage 1.15 V to 1.25 V
-Minimum Operating Temperature 0 C
-Maximum Operating Frequency 315 MHz
-Package / Case FBGA-324
-Number of Logic Blocks 1539
-Distributed RAM 608 kbit
-Number of I/Os 215
-Number of Logic Blocks 1539
-Maximum Operating Temperature + 70 C
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