Integrated Circuit (IC) packages or semiconductor packages are designed to provide protective cover for the semiconductor device. The idea is to use the package to cover the semiconductor device so it isn’t negatively affected by excessive thermal (heat) dissipation and other foreign elements on the circuit board.
In this article, you are going to find out some of the important attributes of the Zig-Zag In-Line Package, one of the Integrated Circuit (IC) packages.
Intended as a Replacement for the DIP Package
Several Integrated Circuit (IC) packages exist, with the Dual In-Line Package (DIP) being one of the most popular. The Zig-Zag In-Line Package or ZIP IC package is intended as a replacement for the Dual In-Line Package (DIP).
Why you may ask? The following are some of the reasons why the Zig-Zag In-Line Package (ZIP) is a better Integrated Circuit (IC) package than the Dual In-Line Package (DIP) is:
1. Pin Spacing
Dual In-Line Package (DIP) is popular for the wider spacing, which led to the limited numbers of pins in the package.
Therefore, it became necessary for the Zig-Zag In-Line Package (ZIP) to serve as a worthy replacement, owing to the higher pin spaces, thanks to the proximity of the pins to each other.
2. Ideal for Multi-Pin Kit
The Zig-Zag In-Line Package (ZIP) is better than the Dual In-Line Package (DIP) because of the customization for multiple pins.
Due to the vertical arrangement of the pins and the position of the same on a grid, its multi-pin kit support proves better than the minimal spacing on the DIP package.
Zig-Zag In-Line Package is a Short-Lived IC Package
Zig-Zag In-Line Package didn’t last as much as the other Integrated Circuit (IC) packages. At the time it became popular, the primary designation or use case was for dynamic Random Access Memory (RAM) chips.
However, the upgrades in the process technology for circuit board packages, the Zig-Zag In-Line Package is fast fazing out. The package is now slowly giving way to the likes of Dual In-Line Package (DIP), Shrink Dual In-Line Package (SDIP) and Standard Integrated Circuit package.
Zig-Zag In-Line Package’s Architecture
The architecture of the ZIP IC package includes the following:
- Derivation of the zig-zag package pattern via the two rows with staggered spacing of 0.05-inch or 1.27mm.
- Encapsulation of the package in a slab of plastic, including 16, 20, 28 and 40 pins.
- Body measurement of 3mm x 30mm x 10mm.
- Protrusion of the package’s pins in two rows, which extend from one side of the package’s long edges.
Features of the Zig-Zag In-Line Package (ZIP)
Below are some of the features or properties of the Zig-Zag In-Line Package (ZIP):
Usable on High-Voltage Applications
Although the Zig-Zag In-Line Package have since been replaced by the modern Surface Mount Technology (SMT) packages, it is still relevant. As of 2008, the package has been used for making packages for high-voltage Operating Amplifiers (Op-Amps) Integrated Circuits (ICS).
The package has also been used in a few other motor driver Integrated Circuits (ICs) and these ICs maintain the zigzag pinouts of the package.
Potential Drawbacks to the Zig-Zag In-Line Package
In spite of the potential benefits of the package, there are still a couple of drawbacks or downsides to take note of.
Here are some of the potential drawbacks of the IC package.
1. Size Drawback
Modern Surface Mount Technology (SMT)-optimized ICs have more sizes and accommodate more pins than the Zig-Zag In-Line Package does.
Therefore, if you are working on an application requiring more pins, it is better to use any of the SMD ICs.
2. Enhanced Performance
Zig-Zag In-Line Package is built with the Through-Hole Technology (THT), which is fast giving the way to the Surface Mount Technology (SMT).
To put it in perspective, some of the Integrated Circuit (IC) packages manufactured with the SMT offer better performance than the THT offers.
However, the Zig-Zag In-Line Package (ZIP) can offer better performance than the Single In-Line Package (SIP) offers. Although the two have a similar style, the ZIP appears to have a consider advantage over the SIP.
The major benefit the Zig-Zag In-Line Package has over the SIP is the pin composition of up to two (2) rows.
The pin rows or terminals of the Zig-Zag In-Line Package are perpendicular, further lending credence to the package’s staggered configuration.
Factors to Choosing the Best IC Package
If you are in the market for an Integrated Circuit (IC) package, cost and the size of the package shouldn’t be the only things you look for.
Here are some of the additional factors you want to consider:
Use Cases or Applications
What are the target devices or applications for the IC package? For the Zig-Zag In-Line Package, the application was for high-powered devices. Although it is not popularly used, the Zig-Zag In-Line Package still has considerable patronage among the motor drivers ICs, and voltage regulators.
Sealing Capacity
The sealing material for the IC package also matters, because you want the package and the semiconductor components to be held in place.
Zig-Zag In-Line Package’s sealing material is made of glass.
Cost of the IC Package
How much will the Zig-Zag In-Line Package cost? The price is sometimes based on the quantity, so you want to buy more to fulfill the Minimum Order Quantity (MOQ) and get a discount.
Compare the Zig-Zag In-Line Package quotes from different suppliers to get a better deal.
Alternatives to the Zig-Zag In-Line Package (ZIP)
This Integrated Circuit (IC) package is now replaced by some of the popular Surface Mount Devices (SMDs), especially those with size advantages.
The two (2) common replacements for the Zig-Zag In-Line Package are the Single In-Line Memory Modules (SIMMs), which are better for one-line packages and the Dual In-Line Memory Modules (DIMMs) for those requiring dual packages.
Conclusion
Choosing to work with the Zig-Zag In-Line Package (ZIP) is a matter of choice, because it has been in use for many years but now superseded by newer IC packages like DIMMs, SIMMs, DIPs and SDIPs.
