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XQR4013XL-3CB228I XQR4013XL development board XQR4013XL-3CB228I Datasheet PDF

XQR4013XL-3CB228I ApplicationField

-Medical Equipment
-Consumer Electronics
-Industrial Control
-Artificial Intelligence
-Cloud Computing
-5G Technology
-Internet of Things
-Wireless Technology

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XQR4013XL-3CB228I FAQ

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Q: Where can I purchase Xilinx XQR4013XL Development Boards, Evaluation Boards, or QPRO XQR4000XL Radiation Hardened FPGAs Starter Kit? also provide technical information?
A: EBICS does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

XQR4013XL-3CB228I Features

Internal node observability
Unlimited reprogrammability
Systems-oriented features
Optional multiplexer or 2-input function generator on device outputs
System featured FPGAs
Guaranteed to meet full electrical specifications over –55°C to +125°C
5V tolerant I/Os
Processed on Xilinx QML line
Buffered interconnect for maximum speed
Fully automatic mapping, placement and routing
Virtually unlimited number of clock signals
Readback capability
Interactive design editor for design optimization
Radiation-hardened FPGAs for space and satellite applications
Guaranteed total ionizing dose
Low power segmented routing architecture
Program verification
Available in -3 speed
Configured by loading binary file
Highest capacity: over 130,000 usable gates
Development system runs on most common computer platforms
Advanced 0.35µ process
Interfaces to popular design environments
Latch-up immune
System performance beyond 60 MHz
Improved VersaRing I/O interconnect for better fixed pinout flexibility
New latch capability in configurable logic blocks
Flexible array architecture

 

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XQR4013XL-3CB228I Overview

 

Power-On Power Supply RequirementsXilinx XQR4013XL-3CB228I FPGAs require a minimum rated power supply current capacity to insure proper initialization, and the power supply ramp-up time does affect the current required. A fast ramp-up time requires more current than a slow ramp-up time. The slowest ramp-up time is 50 ms. Current capacity is not specified for a ramp-up time faster than 2 ms. The current capacity varies linealy with ramp-up time, e.g., an XQR4036XL with a ramp-up time of 25 ms would require a capacity predicted by the point on the straight line drawn from 1A at 120 µs to 500 mA at 50 ms at the 25 ms time mark. This point is approximately 750 mA .XQR4013XL-3CB228I AC Switching CharacteristicTesting of the switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100% functionally tested. Internal timing parameters are derived from measuring internal test patterns. Listed below are representative values where one global clock input drives one vertical clock line in each accessible column, and where all accessible IOB and CLB flip-flops are clocked by the global clock net.When fewer vertical clock lines are connected, the clock distribution is faster; when multiple clock lines per column are driven from the same global clock, the delay is longer. For more specific, more precise, and worst-case guaranteed data, reflecting the actual routing structure, use the values provided by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist. These path delays, provided as a guideline, have been extracted from the static timing analyzer report. All timing parameters assume worst-case operating conditions (supply voltage and junction temperature)XQR4013XL-3CB228I CLB Switching Characteristic GuidelinesTesting of switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100% functionally tested. Internal timing parameters are derived from measuring internal test patterns. Listed below are representative values. For more specific, more precise, and worst-case guaranteed data, use the values reported by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist. All timing parameters assume worst-case operating conditions (supply voltage and junction temperature). Values apply to all XQR4000XL devices and expressed in nanoseconds unless otherwise noted.

XQR4013XL-3CB228I Tags

XQR4013XL evaluation board
QPRO XQR4000XL Radiation Hardened FPGAs evaluation kit
QPRO XQR4000XL Radiation Hardened FPGAs XQR4013XL
QPRO XQR4000XL Radiation Hardened FPGAs starter kit
XQR4013XL-3CB228I Datasheet PDF
XQR4013XL reference design
XQR4013XL development board
Xilinx XQR4013XL

XQR4013XL-3CB228I TechnicalAttributes

 

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