Xilinx XCZU9EG-L1FFVB1156I is available in the following FPGA speed grades: -1, -2, and -3. However, the -3E devices have been attributed to pack more speed that improve the performance of the Integrated Circuit (IC).
Beyond the speed grades, the IC has a wide range of other innovative features you want to take note of. So, in this article, we are going to dive deeper into some of the additional features plus technical specifications of the Xilinx XCZU9EG-L1FFVB1156I FPGA.
Technical Attributes of Xilinx XCZU9EG-L1FFVB1156I
Let us start with some of the technical attributes of the Xilinx XCZU9EG-L1FFVB1156I FPGA. Here they are:
1. L1 Cache Data Memory
Field Programmable Gate Arrays (FPGAs) use cache to store data. According to IJERA, “cache systems are on-chip memory element used to store data.”
By design, they allow for the tracking of induced miss rate in cache memory. That way, the data or information shared among the parallel accelerators and processor would be “cached.”
With that being said, a Level One (L1) cache in an FPGA is the primary cache or memory cache built directly into the microprocessor. As the main cache, it is responsible for storing the recently accessed information in the microprocessor/FPGA.
Xilinx XCZU9EG-L1FFVB1156I’s L1 Cache Data Memory measures 2 x 32 KB and 4 x32 KB.
Xilinx XCZU9EG-L1FFVB1156I also has an L1 Cache Data Instruction Memory that measures the same. Type of memory is responsible for the information about the operation of the FPGA.
2. Moisture Sensitivity Level (MSL)
This is the packaging and handling precautions that must be in place when dealing with semiconductors. As the “floor life” of the FPGA or semiconductor, it helps determine how long it will take for the chip to become exposed to ambient room conditions after it has been opened.
Xilinx XCZU9EG-L1FFVB1156I’s Moisture Sensitivity Level (MSL) is 4, which is equivalent to 72 hours. This means that within 3 days from the time of exposure to ambient room conditions, the Xilinx XCZU9EG-L1FFVB1156I is likely to be baked.
3. Array of Connectivity Options
Xilinx XCZU9EG-L1FFVB1156I has several ways or interfaces for connecting the FPGA with other parts within the system.
The connectivity options range from CANbus, USB OTG, EBI/EMI, UART/USART, Ethernet, MMC/SD/SDIO, I2C and SPI.
4. Excellent Processors
Xilinx XCZU9EG-L1FFVB1156I’s 7 cores are powered by different powerful cores supplied by AMD Xilinx.
Examples of these processors are Quad ARM Cortex A-53 MPCore with CoreSight, ARM Mali-400 MP2 and Dual ARM Cortex-R5 with CoreSight.
Advantages of Xilinx XCZU9EG-L1FFVB1156I’s System on a Chip (SoC)
In this section, we are going to talk about some of the advantages of benefits of the System on a Chip (SoC) architecture of Xilinx XCZU9EG-L1FFVB1156I.
1. Faster Cycle Time
The cycle time for Xilinx XCZU9EG-L1FFVB1156I is greatly reduced because of the overall faster execution of the chip.
The faster execution is derived from the high-speed processors (as mentioned before) and the associating memory.
2. Compact Size
Xilinx XCZU9EG-L1FFVB1156I’s System on a Chip architecture has a smaller footprint, which helps in packing the components and compressing space into the chip.
That is one of the reasons why the Xilinx XCZU9EG-L1FFVB1156I is lightweight.
Conclusion
From this review, you can tell that the Xilinx XCZU9EG-L1FFVB1156I is not only lightweight, but also boasts of high-performance and speed.
Contact Rayming Technology (RayPCB) for a quotation on what it will cost to design and configure the Xilinx XCZU9EG-L1FFVB1156I FPGA.
