XCV812E-6FG900C ApplicationField
-Industrial Control
-Wireless Technology
-Consumer Electronics
-Artificial Intelligence
-5G Technology
-Cloud Computing
-Medical Equipment
-Internet of Things
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XCV812E-6FG900C FAQ
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A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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XCV812E-6FG900C Features
RF Data Converter Subsystem Overview
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XCV812E-6FG900C Overview
The XCV812E-6FG900C delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 6-layer metal 0.18 μm CMOS process. the XCV812E-6FG900C delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.
The Xilinx Fusible series XCV812E-6FG900C is Fuse, Automotive, Bolt Down, Time Delay, 100A, 32V, 68.58mm x 16.2mm x 10.67mm, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at EBICS.com,
and you can also search for other FPGAs products.
XCV812E-6FG900C Tags
XCV812E evaluation board
Xilinx XCV812E
XCV812E-6FG900C Datasheet PDF
Virtex-EM 1.8V FPGAs starter kit
XCV812E development board
XCV812E reference design
Virtex-EM 1.8V FPGAs evaluation kit
Xilinx Virtex-EM 1.8V FPGAs development board
XCV812E-6FG900C TechnicalAttributes
-Number of Gates 254016
-Supplier Device Package 900-FBGA (31×31)
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Number of I/O 556
-Number of Logic Elements/Cells 21168
-Package / Case 900-BBGA
-Number of LABs/CLBs 4704
-Total RAM Bits 1146880
-Voltage – Supply 1.71V ~ 1.89V
-Mounting Type Surface Mount
-Total RAM Bits 1146880
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