XCV200E-8FG256C XCV200E reference design XCV200E-8FG256C Datasheet PDF

XCV200E-8FG256C ApplicationField

-Consumer Electronics
-Artificial Intelligence
-Cloud Computing
-Wireless Technology
-Internet of Things
-Medical Equipment
-Industrial Control
-5G Technology

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XCV200E-8FG256C FAQ

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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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Q: Where can I purchase Xilinx XCV200E Development Boards, Evaluation Boards, or Virtex-E 1.8V FPGAs Starter Kit? also provide technical information?
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XCV200E-8FG256C Features

RF Data Converter Subsystem Overview

 

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XCV200E-8FG256C Overview

 

General Description

The Virtex-E FPGA family delivers high-performance,
high-capacity programmable logic solutions. Dramatic
increases in silicon efficiency result from optimizing the new
architecture for place-and-route efficiency and exploiting an
aggressive 6-layer metal 0.18 μm CMOS process. These
advances make Virtex-E FPGAs powerful and flexible alternatives to mask-programmed gate arrays. 

Building on experience gained from Virtex FPGAs, the
Virtex-E family is an evolutionary step forward in programmable logic design. Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible
interconnect resources, and advanced process technology,
the Virtex-E family delivers a high-speed and high-capacity
programmable logic solution that enhances design flexibility
while reducing time-to-market.

Features

• Fast, High-Density 1.8 V FPGA Family 

– Densities from 58 k to 4 M system gates 

– 130 MHz internal performance (four LUT levels) 

– Designed for low-power operation 

– PCI compliant 3.3 V, 32/64-bit, 33/ 66-MHz 

• Highly Flexible SelectI/O+™ Technology 

– Supports 20 high-performance interface standards 

– Up to 804 singled-ended I/Os or 344 differential I/O
pairs for an aggregate bandwidth of > 100 Gb/s 

• Differential Signalling Support 

– LVDS (622 Mb/s), BLVDS (Bus LVDS), LVPECL 

– Differential I/O signals can be input, output, or I/O
– Compatible with standard differential devices 

– LVPECL and LVDS clock inputs for 300+ MHz
clocks 

• Proprietary High-Performance SelectLink™
Technology 

– Double Data Rate (DDR) to Virtex-E link 

– Web-based HDL generation methodology 

• Sophisticated SelectRAM+™ Memory Hierarchy 

– 1 Mb of internal configurable distributed RAM 

– Up to 832 Kb of synchronous internal block RAM 

– True Dual-Port BlockRAM capability 

– Memory bandwidth up to 1.66 Tb/s (equivalent
bandwidth of over 100 RAMBUS channels) 

– Designed for high-performance Interfaces to
External Memories 

– 200 MHz ZBT* SRAMs
– 200 Mb/s DDR SDRAMs 

– Supported by free Synthesizable reference design 

• High-Performance Built-In Clock Management Circuitry 

– Eight fully digital Delay-Locked Loops (DLLs) 

– Digitally-Synthesized 50% duty cycle for Double
Data Rate (DDR) Applications 

– Clock Multiply and Divide
– Zero-delay conversion of high-speed LVPECL/LVDS
clocks to any I/O standard 

• Flexible Architecture Balances Speed and Density 

– Dedicated carry logic for high-speed arithmetic
– Dedicated multiplier support 

– Cascade chain for wide-input function 

– Abundant registers/latches with clock enable, and
dual synchronous/asynchronous set and reset 

– Internal 3-state bussing 

– IEEE 1149.1 boundary-scan logic 

– Die-temperature sensor diode 

• Supported by Xilinx Foundation™ and Alliance Series™
Development Systems 

– Further compile time reduction of 50% 

– Internet Team Design (ITD) tool ideal for
million-plus gate density designs 

– Wide selection of PC and workstation platforms 

• SRAM-Based In

-System Configuration 

– Unlimited re-programmability 

• Advanced Packaging Options 

– 0.8 mm Chip-scale 

– 1.0 mm BGA 

– 1.27 mm BGA 

– HQ/PQ 

• 0.18 μm 6-Layer Metal Process 

• 100% Factory Tested

The Xilinx Socle de fusible series XCV200E-8FG256C is Virtex-E 1.8 V Field Programmable Gate Arrays, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at EBICS.com,
and you can also search for other FPGAs products.

XCV200E-8FG256C Tags

XCV200E evaluation board
Virtex-E 1.8V FPGAs XCV200E
Virtex-E 1.8V FPGAs evaluation kit
Xilinx XCV200E
XCV200E-8FG256C Datasheet PDF
Virtex-E 1.8V FPGAs starter kit
XCV200E reference design
XCV200E development board

XCV200E-8FG256C TechnicalAttributes

-Voltage – Supply 1.71V ~ 1.89V
-Package / Case 256-BGA
-Supplier Device Package 256-FBGA (17×17)
-Total RAM Bits 114688
-Number of Gates 306393
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Mounting Type Surface Mount
-Number of Logic Elements/Cells 5292
-Number of I/O 176
-Number of LABs/CLBs 1176
-Number of Logic Elements/Cells 5292

 

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