XC7Z035-2FFG676E ApplicationField
-Consumer Electronics
-Medical Equipment
-5G Technology
-Industrial Control
-Internet of Things
-Wireless Technology
-Cloud Computing
-Artificial Intelligence
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XC7Z035-2FFG676E FAQ
Q: Where can I purchase Xilinx XC7Z035 Development Boards, Evaluation Boards, or Zynq-7000 SoC Starter Kit? also provide technical information?
A: EBICS does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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A: Enter the “XC7Z035-2FFG676E” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
XC7Z035-2FFG676E Features
• 25-bit pre-adder
• Flip-flops
Programmable I/O Blocks
• 18 x 25 signed multiply
• Cascadeable adders
DSP Blocks
• Programmable I/O delay and SerDes
• Look-up tables (LUT)
• Supports LVCMOS, LVDS, and SSTL
• 1.2V to 3.3V I/O
• Configurable as dual 18 Kb block RAM
• Up to 72 bits wide
• True Dual-Port
36 Kb Block RAM
• 48-bit adder/accumulator
Configurable Logic Blocks (CLB)
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XC7Z035-2FFG676E Overview
The Zynq-7000 family XC7Z035-2FFG676E is based on the Xilinx SoC architecture. These products integrate a feature-rich dual-core or single-core ARM Cortex-A9 based processing system (PS) and 28 nm Xilinx programmable logic (PL) in a single device. The ARM Cortex-A9 CPUs are the heart of the PS and also include on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces.The XC7Z035-2FFG676E SoCs are available in -3, -2, -2LI, -1, and -1LQ speed grades, with -3 having the highest performance. The -2LI devices operate at programmable logic (PL) VCCINT/VCCBRAM = 0.95V and are screened for lower maximum static power. The speed specification of a -2LI device is the same as that of a -2 device. The -1LQ devices operate at the same voltage and speed as the -1Q devices and are screened for lower power. Zynq XC7Z035-2FFG676E device DC and AC characteristics are specified in commercial, extended, industrial, and expanded (Q-temp) temperature ranges. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade industrial device are the same as for a -1 speed grade commercial device). However, only selected speed grades and/or devices are available in the commercial, extended, or industrial temperature ranges. All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters included are common to popular designs and typical applications.
The Xilinx Embedded – System On Chip (SoC) series XC7Z035-2FFG676E is Zynq-7000 SOC CORTEX-A9 800MHZ 676FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at EBICS.com,
and you can also search for other FPGAs products.
XC7Z035-2FFG676E Tags
XC7Z035 reference design
Xilinx Zynq-7000 SoC development board
XC7Z035 evaluation board
XC7Z035-2FFG676E Datasheet PDF
Xilinx XC7Z035
Zynq-7000 SoC starter kit
Zynq-7000 SoC evaluation kit
Zynq-7000 SoC XC7Z035
XC7Z035-2FFG676E TechnicalAttributes
-Primary Attributes Kintex?-7 FPGA, 275K Logic Cells
-Speed 800MHz
-Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
-Operating Temperature 0℃ ~ 100℃ (TJ)
-Architecture MCU, FPGA
-Supplier Device Package 676-FCBGA (27×27)
-RAM Size 256KB
-Peripherals DMA
-Package / Case 676-BBGA, FCBGA
-RAM Size 256KB
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