{"id":32149,"date":"2022-10-10T07:56:04","date_gmt":"2022-10-10T07:56:04","guid":{"rendered":"https:\/\/ebics.net\/?p=32149"},"modified":"2022-10-10T07:57:50","modified_gmt":"2022-10-10T07:57:50","slug":"dip-ic-package","status":"publish","type":"post","link":"https:\/\/ebics.net\/dip-ic-package\/","title":{"rendered":"Working with the Rectangular DIP IC Package: What You Need to Know"},"content":{"rendered":"\n<p>Printed Circuit Board (PCB) and semiconductor consumers prefer using the DIP <a href=\"https:\/\/ebics.net\/ic-chip\/\">IC<\/a> package for several reasons, ranging from varied configuration process and the support for multiple devices. in this blog post, you are going to learn more about what the DIP is, including some of the optimization processes.<\/p>\n\n\n\n<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_56_1 counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title \" >Table of Contents<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\" role=\"button\"><label for=\"item-662eeb99c5f90\" ><span class=\"\"><span style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/label><input aria-label=\"Toggle\" aria-label=\"item-662eeb99c5f90\"  type=\"checkbox\" id=\"item-662eeb99c5f90\"><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1 eztoc-toggle-hide-by-default' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/ebics.net\/dip-ic-package\/#The_Meaning_of_DIP\" title=\"The Meaning of DIP\">The Meaning of DIP<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/ebics.net\/dip-ic-package\/#Facts_about_the_THT\" title=\"Facts about the THT\">Facts about the THT<\/a><ul class='ez-toc-list-level-3'><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/ebics.net\/dip-ic-package\/#1_DIP_is_Generally_a_Rectangular_Package\" title=\"1.&nbsp;DIP is Generally a Rectangular Package\">1.&nbsp;DIP is Generally a Rectangular Package<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/ebics.net\/dip-ic-package\/#2_The_Design_Process\" title=\"2.&nbsp;The Design Process\">2.&nbsp;The Design Process<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/ebics.net\/dip-ic-package\/#Features_of_the_Dual_In-Line_Package_DIP\" title=\"Features of the Dual In-Line Package (DIP)\">Features of the Dual In-Line Package (DIP)<\/a><ul class='ez-toc-list-level-3'><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/ebics.net\/dip-ic-package\/#1_Dual_In-Line_Packages_have_Even_Lead_Counts\" title=\"1.&nbsp;Dual In-Line Packages have Even Lead Counts\">1.&nbsp;Dual In-Line Packages have Even Lead Counts<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/ebics.net\/dip-ic-package\/#2_Varied_Pin_Pitches\" title=\"2.&nbsp;Varied Pin Pitches\">2.&nbsp;Varied Pin Pitches<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/ebics.net\/dip-ic-package\/#3_DIPs_Real_Estate_is_Impressive\" title=\"3.&nbsp;DIP\u2019s Real Estate is Impressive\">3.&nbsp;DIP\u2019s Real Estate is Impressive<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/ebics.net\/dip-ic-package\/#4_Versatile_Mounting_Processes\" title=\"4.&nbsp;Versatile Mounting Processes\">4.&nbsp;Versatile Mounting Processes<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/ebics.net\/dip-ic-package\/#5_DIP_Uses_Spring-Contact_Sockets\" title=\"5.&nbsp;DIP Uses Spring-Contact Sockets\">5.&nbsp;DIP Uses Spring-Contact Sockets<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/ebics.net\/dip-ic-package\/#6_Several_DIPs_Exist\" title=\"6.&nbsp;Several DIPs Exist\">6.&nbsp;Several DIPs Exist<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/ebics.net\/dip-ic-package\/#7_DIP_has_Extensive_Use_Cases\" title=\"7.&nbsp;DIP has Extensive Use Cases\">7.&nbsp;DIP has Extensive Use Cases<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/ebics.net\/dip-ic-package\/#8_Easy_Component_Removal\" title=\"8.&nbsp;Easy Component Removal\">8.&nbsp;Easy Component Removal<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/ebics.net\/dip-ic-package\/#Final_Thoughts\" title=\"Final Thoughts\">Final Thoughts<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"The_Meaning_of_DIP\"><\/span><strong>The Meaning of DIP<\/strong><strong><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>The full name is <strong>Dual In-Line Package<\/strong>. In a layman\u2019s understanding, it is the <a href=\"https:\/\/ebics.net\/integrated-circuit\/\">Integrated Circuit<\/a> (IC) package with a dual configuration process, especially around the leads.<\/p>\n\n\n\n<p>According to Wikipedia, the package has a \u201crectangular housing and two parallel rows of electrical connecting pins.\u201d It is from these connecting pins that the package derived the \u201cdual in-line\u201d name.<\/p>\n\n\n\n<p>One of the advantages of the dual connecting pins is the direction or position of the pins, especially the fact that they are all parallel, extend past the bottom of the <a href=\"https:\/\/ebics.net\/packaged-ic\/\">IC package<\/a> and point downward.<\/p>\n\n\n\n<p>As a Through-Hole Technology (THT)-powered IC package, DIP\u2019s dual pins help to facilitate the mounting of the semiconductor components after drilling the holes.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button aligncenter\"><a class=\"wp-block-button__link has-vivid-cyan-blue-background-color has-background\" href=\"http:\/\/ebics.net\/#contact\"><strong>Request FPGA Chip or Full BOM List Quote Now<\/strong><\/a><\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Facts_about_the_THT\"><\/span><strong>Facts about the THT<\/strong><strong><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"1000\" height=\"457\" src=\"https:\/\/ebics.net\/wp-content\/uploads\/2022\/10\/DIP-IC-Package.jpg\" alt=\"DIP IC Package\" class=\"wp-image-32150\" srcset=\"https:\/\/ebics.net\/wp-content\/uploads\/2022\/10\/DIP-IC-Package.jpg 1000w, https:\/\/ebics.net\/wp-content\/uploads\/2022\/10\/DIP-IC-Package-600x274.jpg 600w, https:\/\/ebics.net\/wp-content\/uploads\/2022\/10\/DIP-IC-Package-300x137.jpg 300w, https:\/\/ebics.net\/wp-content\/uploads\/2022\/10\/DIP-IC-Package-768x351.jpg 768w\" sizes=\"(max-width: 1000px) 100vw, 1000px\" \/><\/figure><\/div>\n\n\n<p>Here are some of the important points you want to have in mind when deciding to work with the Dual In-Line Package (DIP):<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_DIP_is_Generally_a_Rectangular_Package\"><\/span><strong>1.&nbsp;<\/strong><strong>DIP is Generally a Rectangular Package<\/strong><strong><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>One important fact is that the DIP is not just any Integrated Circuit (IC) package with two (2) parallel rows of connecting pins.<\/p>\n\n\n\n<p>It can also be an IC package with the pins emerging from the bottom of the package, or from the sides of the package. It is also used to describe any IC package with the pins curving or bending downwards.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_The_Design_Process\"><\/span><strong>2.&nbsp;<\/strong><strong>The Design Process<\/strong><strong><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>DIP is primarily a<a href=\"https:\/\/en.wikipedia.org\/wiki\/Through-hole_technology#:~:text=In%20electronics%2C%20through%2Dhole%20technology,the%20use%20of%20automated%20insertion\"> Through-Hole Technology <\/a>(THT) IC package, meaning that the semiconductor components are mounted after drilling holes on the Printed Circuit Board (PCB).<\/p>\n\n\n\n<p>The IC package can also be inserted after the package has been placed on a supported zero insertion force socket.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Features_of_the_Dual_In-Line_Package_DIP\"><\/span><strong>Features of the Dual In-Line Package (DIP)<\/strong><strong><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>These are some of the attributes or features of the package:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Dual_In-Line_Packages_have_Even_Lead_Counts\"><\/span><strong>1.&nbsp;<\/strong><strong>Dual In-Line Packages have Even Lead Counts<\/strong><strong><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The leads used in the DIP usually have an even count, with examples being the use of 8, 14, 16, 18 and 28 on a 0.3-inch spacing.<\/p>\n\n\n\n<p>One of the reasons for the even lead spacing is the package\u2019s use of a set of <strong>Unused Not Connected (NC)<\/strong>&nbsp;leads attached to the internal chip of the package.<\/p>\n\n\n\n<p>The package typically conforms to the JEDEC standard of using inter-spacing among the leads. That amounts to up to 2.54mm or 0.1-inch.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Varied_Pin_Pitches\"><\/span><strong>2.&nbsp;<\/strong><strong>Varied Pin Pitches<\/strong><strong><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The pitches used in the Dual In-Line Packages (DIPs) also differ. For example, the typical pin pitch is 15.2mm but it is not restricted to that.<\/p>\n\n\n\n<p>There are variants ranging from the 10.16mm pin pitch, which is sometimes called the <strong>Slim Dual In-Line Package<\/strong>. The other variant is the <strong>Skinny Dual In-Line Package<\/strong>&nbsp;with a pin pitch of 7.52mm.<\/p>\n\n\n\n<p>Note that these pin pitches may not always be referred by their individual names. Rather, they are sometimes generally called the <strong>Dual In-Line Package (DIP)<\/strong>.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button aligncenter\"><a class=\"wp-block-button__link has-vivid-cyan-blue-background-color has-background\" href=\"http:\/\/ebics.net\/#contact\"><strong>Request FPGA Chip or Full BOM List Quote Now<\/strong><\/a><\/div>\n<\/div>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_DIPs_Real_Estate_is_Impressive\"><\/span><strong>3.&nbsp;<\/strong><strong>DIP\u2019s Real Estate is Impressive<\/strong><strong><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><a href=\"https:\/\/www.raypcb.com\/\"><img loading=\"lazy\" decoding=\"async\" width=\"1000\" height=\"522\" src=\"https:\/\/ebics.net\/wp-content\/uploads\/2022\/07\/Full-pcb-manufacturing-.jpg\" alt=\"Full pcb manufacturing\" class=\"wp-image-2406\" srcset=\"https:\/\/ebics.net\/wp-content\/uploads\/2022\/07\/Full-pcb-manufacturing-.jpg 1000w, https:\/\/ebics.net\/wp-content\/uploads\/2022\/07\/Full-pcb-manufacturing--600x313.jpg 600w, https:\/\/ebics.net\/wp-content\/uploads\/2022\/07\/Full-pcb-manufacturing--300x157.jpg 300w, https:\/\/ebics.net\/wp-content\/uploads\/2022\/07\/Full-pcb-manufacturing--768x401.jpg 768w\" sizes=\"(max-width: 1000px) 100vw, 1000px\" \/><\/a><\/figure><\/div>\n\n\n<p>Dual In-Line Package (DIP) is so-called because of the architecture it uses. To put it in perspective, the package uses the parallel or dual arrangement for the pins. That is why it is best described as the <strong>dual connecting pin-IC package<\/strong>.<\/p>\n\n\n\n<p>The most important component of DIP\u2019s real estate\/architecture is the rectangular housing with a multiple of four (4) pins per side.<\/p>\n\n\n\n<p>The shape or overall design of the package may differ, depending on the placement model and size of the semiconductor components.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Versatile_Mounting_Processes\"><\/span><strong>4.&nbsp;<\/strong><strong>Versatile Mounting Processes<\/strong><strong><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Powered by the Through-Hole Technology (THT) PCB component mounting process, the DIP IC package offers versatility.<\/p>\n\n\n\n<p>Although the drilling of holes is the major process, the package also supports other processes, which have been explained below.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_DIP_Uses_Spring-Contact_Sockets\"><\/span><strong>5.&nbsp;<\/strong><strong>DIP Uses Spring-Contact Sockets<\/strong><strong><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>These are also called the <strong>zero insertion force sockets<\/strong>. The primary function of the sockets is to enable the placement of the semiconductor components by plugging the semiconductor components into the sockets. From here, the semiconductor or test equipment will be connected or placed between the sockets and the circuit board.<\/p>\n\n\n\n<p>Another important feature of the spring-contact sockets is that they can be easily removed or swapped with other sockets. The supported devices can also be removed with ease and replaced rather than risking the decoupling of the package, thereby, possibly leading to overheating.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"6_Several_DIPs_Exist\"><\/span><strong>6.&nbsp;<\/strong><strong>Several DIPs Exist<\/strong><strong><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The Dual In-Line Package (DIP) has many variants, ranging from the shrunk or smaller variant called the <strong>Shrink Dual In-Line Package (SDIP)<\/strong>&nbsp;to the <strong>Plastic Dual In-Line Package (<a href=\"https:\/\/ebics.net\/pdip\/\">PDIP<\/a>)<\/strong>, which has plastic as the base material.<\/p>\n\n\n\n<p>The DIP IC package also has the following variants:<\/p>\n\n\n\n<ul><li>Skinny Dual In-Line Package (SDIP)<\/li><li>Ceramic Dual In-Line Package (CDIP), with ceramic as the base material.<\/li><\/ul>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button aligncenter\"><a class=\"wp-block-button__link has-vivid-cyan-blue-background-color has-background\" href=\"http:\/\/ebics.net\/#contact\"><strong>Request FPGA Chip or Full BOM List Quote Now<\/strong><\/a><\/div>\n<\/div>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"7_DIP_has_Extensive_Use_Cases\"><\/span><strong>7.&nbsp;<\/strong><strong>DIP has Extensive Use Cases<\/strong><strong><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The use cases or applications of the DIP cut across the production of automated assembly equipment, making prototypes of Printed Circuit Boards (PCBs) on a breadboard and making the arrays of discrete components, such as resistors.<\/p>\n\n\n\n<p>The use cases or applications of the Dual In-Line IC Package (DIP) also includes the following:<\/p>\n\n\n\n<ul><li>Integrated Circuits (ICs) or chips for semiconductors. Examples are Microprocessors, logic gates, and analog circuit boards.<\/li><li>DIP Switches, also called the <strong>miniature rockers<\/strong>&nbsp;or <strong>slide switches<\/strong>.<\/li><li>Light Emitting Diode (LED) arrays. Examples of these arrays are electromechanical relays, light bars, segmented displays, miniature rotary encoder switches and bargraph displays.<\/li><\/ul>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"8_Easy_Component_Removal\"><\/span><strong>8.&nbsp;<\/strong><strong>Easy Component Removal<\/strong><strong><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Some semiconductor components can malfunction or get damaged for one reason or the other. Some IC packages may be unable to facilitate the removal easily, but the Dual In-Line Package (DIP) can do that.<\/p>\n\n\n\n<p>The ease of removing the grouped components is possible because of DIP\u2019s <strong>Header Blocks<\/strong>. These blocks aid the easy removal of groups of semiconductor components that either need to be reconfigured or replaced.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Final_Thoughts\"><\/span><strong>Final Thoughts<\/strong><strong><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>Dual In-Line Package (DIP) is one of the popular Integrated Circuits (ICs), offering a mix of flexible semiconductor component placement, easy component removal and flexible routing of the Printed Circuit Board (PCB) traces beneath the package.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Printed Circuit Board (PCB) and semiconductor consumers prefer using the DIP IC package for several reasons, ranging from varied configuration process and the support for multiple devices. in this blog post, you are going to learn more about what the DIP is, including some of the optimization processes. The Meaning of DIP The full name [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":32150,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[69],"tags":[],"acf":[],"jetpack_sharing_enabled":true,"jetpack_featured_media_url":"https:\/\/ebics.net\/wp-content\/uploads\/2022\/10\/DIP-IC-Package.jpg","_links":{"self":[{"href":"https:\/\/ebics.net\/wp-json\/wp\/v2\/posts\/32149"}],"collection":[{"href":"https:\/\/ebics.net\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ebics.net\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ebics.net\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ebics.net\/wp-json\/wp\/v2\/comments?post=32149"}],"version-history":[{"count":0,"href":"https:\/\/ebics.net\/wp-json\/wp\/v2\/posts\/32149\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/ebics.net\/wp-json\/wp\/v2\/media\/32150"}],"wp:attachment":[{"href":"https:\/\/ebics.net\/wp-json\/wp\/v2\/media?parent=32149"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ebics.net\/wp-json\/wp\/v2\/categories?post=32149"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ebics.net\/wp-json\/wp\/v2\/tags?post=32149"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}