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The Fusion mixed signal FPGA satisfies the demand from system architects for a device that simplifies
design and unleashes their creativity. As the world’s first mixed signal programmable logic family, Fusion
integrates mixed signal analog, flash memory, and FPGA fabric in a monolithic device. Fusion devices
enable designers to quickly move from concept to completed design and then deliver feature-rich
systems to market. This new technology takes advantage of the unique properties of Microsemi
flash-based FPGAs, including a high-isolation, triple-well process and the ability to support high-voltage
transistors to meet the demanding requirements of mixed signal system design.
Fusion mixed signal FPGAs bring the benefits of programmable logic to many application areas,
including power management, smart battery charging, clock generation and management, and motor
control. Until now, these applications have only been implemented with costly and space-consuming
discrete analog components or mixed signal ASIC solutions. Fusion mixed signal FPGAs present new
capabilities for system development by allowing designers to integrate a wide range of functionality into a
single device, while at the same time offering the flexibility of upgrades late in the manufacturing process
or after the device is in the field. Fusion devices provide an excellent alternative to costly and
time-consuming mixed signal ASIC designs. In addition, when used in conjunction with the ARM
Cortex-M1 processor, Fusion technology represents the definitive mixed signal FPGA platform.
The Microsemi Embedded – FPGAs (Field Programmable Gate Array) series M1AFS1500-FGG256I is IC FPGA 119 I/O 256FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at EBICS.com,
and you can also search for other FPGAs products.
Fusion of Mixed Signal FPGAs starter kit
M1AFS1500 development board
Fusion of Mixed Signal FPGAs evaluation kit
Fusion of Mixed Signal FPGAs M1AFS1500
M1AFS1500 evaluation board
M1AFS1500 reference design
Microsemi Fusion of Mixed Signal FPGAs development board
-Package / Case 256-LBGA
-Number of I/O 119
-Mounting Type Surface Mount
-Number of Gates 1500000
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Supplier Device Package 256-FPBGA (17×17)
-Voltage – Supply 1.425V ~ 1.575V
-Total RAM Bits 276480
-Total RAM Bits 276480
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