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EP3C25F256C8N Cyclone III FPGAs evaluation kit EP3C25F256C8N Datasheet PDF

EP3C25F256C8N ApplicationField

-Cloud Computing
-Internet of Things
-Artificial Intelligence
-Industrial Control
-Consumer Electronics
-5G Technology
-Wireless Technology
-Medical Equipment

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EP3C25F256C8N FAQ

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Q: How to obtain EP3C25F256C8N technical support documents?
A: Enter the “EP3C25F256C8N” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: How can I obtain software development tools related to the INTEL FPGA platform?
A: Quartus Prime Modelsim is the corresponding programming software for FPGA produced by Altera/Intel. The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: Does the price of EP3C25F256C8N devices fluctuate frequently?
A: The EBICS search engine monitors the EP3C25F256C8N inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.

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A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the EP3C25F256C8N pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.

Q: Where can I purchase INTEL EP3C25 Development Boards, Evaluation Boards, or Cyclone III FPGAs Starter Kit? also provide technical information?
A: EBICS does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

EP3C25F256C8N Features

Cyclone III LS devices offer the following design security features:

 

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EP3C25F256C8N Overview

 

Cyclone III EP3C25F256C8N device offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants:■ Cyclone III—lowest power, high functionality with the lowest cost■ Cyclone III LS—lowest power FPGAs with securityWith densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power consumption, Cyclone III EP3C25F256C8N makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software, and intellectual property (IP) level on a low-power and high-functionality FPGA platform. This suite of security features protects the IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation which enables you to introduce redundancy in a single chip to reduce size, weight, and power of your application.Design Security Feature
The INTEL Embedded – FPGAs (Field Programmable Gate Array) series EP3C25F256C8N is IC CYCLONE III Family 24624 Cells 402MHz 65nm Technology 1.2V FPGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at EBICS.com,
and you can also search for other FPGAs products.


EP3C25F256C8N Tags

Cyclone III FPGAs EP3C25
EP3C25 development board
Cyclone III FPGAs starter kit
INTEL EP3C25
EP3C25F256C8N Datasheet PDF
EP3C25 evaluation board
Cyclone III FPGAs evaluation kit
INTEL Cyclone III FPGAs development board

EP3C25F256C8N TechnicalAttributes

-Number of Logic Blocks 1539
-Minimum Operating Temperature 0 C
-Maximum Operating Frequency 315 MHz
-Package / Case FBGA-256
-Packaging Tray
-Distributed RAM 608 kbit
-Series Cyclone III
-Maximum Operating Temperature + 70 C
-Operating Supply Voltage 1.15 V to 1.25 V
-Mounting Style SMD/SMT
-Maximum Operating Temperature + 70 C
-Number of I/Os 156

 

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