Your computer has a processor, and that processor bears a home known as a socket. CPU sockets do not tend to come up during processor discussion as they don’t hinder nor help in terms of performance. However, they do offer shape standardization for specific CPU generations. But why then should we care about processor sockets? Well, that is because you cannot upgrade your processor without knowing your processor’s socket type. The socket type that your motherboard bears dictates the kind of processor you can utilize. In our case, we shall be looking at the BGA 1667, a fascinating socket that provides impeccable efficiency. But what features does this socket bear? And does it stand out when you compare it with other sockets?
How a Processor Socket Works
A processor socket works almost like the socket that we utilize to turn our lights on and off. The light sockets complete the bulb’s circuitry and connect it to a power grid when you switch on your lights. In simpler terms, the light socket connects the bulb to an efficient electronic network. Similarly, the processor socket, in this case, the BGA 1667, connects your processor to your computer. It provides power and means for the processor to efficiently transmit and receive information.
Why the BGA 1667 is Incredibly Efficient
A BGA (ball grid array) socket is simply a processor socket that utilizes BGA SMD (surface mount-based) packaging. BGA sockets bear a couple of similarities when comparing them with other socket types such as LGA and PGA. For one, these sockets connect your processor to your computer’s motherboard. The connection that these sockets make provides electrical connectivity and physical support. Secondly, most processor sockets, including BGA sockets, arrange their connection pins and balls following a grid format.
However, just as the name suggests, BGA utilizes lead balls to make connections that make them stand out. Furthermore, the connection balls in BGA sockets are placed on the backside of the chip rather than on the chip’s edges. Since the back side has more surface area when you compare it to the edges, you can hence achieve more connections with BGA. But this is just the tip of the iceberg as to what you can achieve with BGA sockets.
Just like other processor sockets, BGA sockets gain their names according to the maximum number of connections they can make. That means that the BGA 1667 can make 1667 connections in one go.
Properties that make the BGA 1667 Socket stand out
The BGA 1667 bears the following features that make it stand out:
- Thermal resistance – BGA 1667 sockets bear impeccable thermal resistance. Due to their fascinating thermal resistance, they can carry power dissipations that rate from 1.92 – 11.69 Watts at 750C. With this impeccable thermal resistance, the BGA 1667 can dissipate heat well even though it has 1667 connections.
- Lead that has low inductance – short leads reduce unwanted inductance, a property that leads to signal distortion. In addition, BGAs have tiny lead balls, which minimizes the distance that exists between the PCB and the package. Due to this short distance, the BGA 1667 can transmit and receive signals efficiently. The short leads also boost the electrical performance of the BGA 1667 socket, helping it reach high-frequency merits.
Other properties that the BGA 1667 socket bears
Packaging
BGA 1667 sockets have impeccable packaging reliability. In addition, these packages utilize modern-day SMD technology, which ultimately lowers their defect rate.
BGA 1667 sockets provide durable solder joints, which boosts their reliability.
Better Alignment
BGA 1667 sockets align perfectly with their spot on the PCB using surface tension from the molten solder. Therefore, you do not need to utilize high-tech equipment for alignment purposes.
Better Flatness
BGA 1667 sockets have flatter and steadier pins when you compare them to QFP package pins. These pins increase the durability of the BGA 1667 socket immensely. They also help manufacturers automatically compensate for errors between the PCB and the chip.
Easier Solder Paste Printing
BGA 1667 sockets ease the process of printing solder paste via stencils onto BGA components. In doing so, they reduce production time and cost immensely.
Large Input and Output lead Pitch
BGA 1667 sockets have a large input and output pitch. Due to this lead pitch, these sockets can easily and effectively hold a more input and output count in one area.
Disadvantages of utilizing BGA 1667 sockets
Even though BGA 1667 sockets bear many advantages, they still bear some disadvantages, which include:
Compliance issues
BGA 1667 sockets utilize solder balls that cannot flex like the more extensive “gull wing” leads of the QFP packages. Unfortunately, that fact breeds a compliance issue in terms of mechanical properties.
Also, since the BGA 1667 is not super flexible, it becomes prone to bending because of the CTE difference between the BGA and the PCB substrate. If bending does occur, it might cause a lot of damage to the chip’s solder joint rendering it unusable. The bend can also come from vibrations and flexing, making this chip vulnerable.
However, you can solve the thermal expansion problem by matching the socket’s thermal and mechanical characteristics to that of the PCB.
Inspection issues
When utilizing the BGA 1667 sockets, you’ll use the bottom part to make connections. However, the bottom part faces the circuit board after attaching the chip onto the circuit board. That makes it challenging to access the board-to-chip connection without altering the link itself.
Due to this disadvantage, you need to utilize the following special machines to inspect the chips bond:
- X-ray machines
- Special microscopes
- CT scanners
- Endoscopes
BGA 1667 Socket Reworking
Since the BGA 1667 utilizes BGA SMD mounting technology, that means that you can rework on the chip if you solder it badly.
Reworking on the BGA 1667 socket lets you fix errors made during the production phase, ultimately lowering losses. Of course, you will have to utilize special machinery to achieve this feat, but it is better than buying a new xilinx fpga chip.
Reballing BGA 1667
If the need arises to upgrade your chips solder balls, you can carry out reballing to fix this issue. Reballing involves removing old, worn-out solder balls and replacing them with new ones.
Carrying out reballing helps you improve your chip’s speed and efficiency, which in turn optimizes its output.
Conclusion
The BGA 1667 socket offers more than just durability and efficiency. It provides quality outputs and faster signal propagation which is essential in the 21st century. Therefore, for the question, does the BGA 1667 stand out when you compare it with other sockets? We’d answer, “the specs speak for themselves.”
